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US 6,332,709 B1Granted
Contact temperature probe with thermal isolation
AssigneeAxcelis Technologies, Inc.
InventorsJohn W. Burke, Andre B. Cardoso, Joseph G. McGinnity
Life of this patent
Estimating the term…
Abstract
A contact temperature probe having a probe head which includes a temperature sensor having lead wires which exit the head and run through a shield for shielding the wires from the process, wherein the probe head is supported for pivoting motion only by the lead wires and the shield is thermally isolated from the probe head.
Claims9
A contact temperature probe for measuring the temperature of a semiconductor wafer in a process environment, comprising:
- a contact temperature probe head having a flat contact surface (4) for contacting the semiconductor wafer and including a temperature sensor having lead wires which exit the probe head and run through a shield (6) for shielding the wires from the process environment,
- wherein the probe head is supported only by the temperature sensor lead wires, and the shield does not touch the probe head.
A contact temperature probe for measuring the temperature of a semiconductor wafer in a process environment, comprising:
- a contact temperature probe head including a flat contact surface for contacting the semiconductor wafer and a body which houses a thermocouple bead having lead wires which exit the body and run through a shield for shielding the wires from the process environment,
- wherein the probe head does not touch the shield and is supported only by the thermocouple lead wires, which are of a stiffness to support the probe head while allowing pivoting movement of the probe head under the weight of the semiconductor wafer.
Dependencies are inferred from the claim text.