Wafer scale micromachine assembly method
AssigneeSandia Corporation
InventorTodd R. Christenson
Life of this patent
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Abstract
A method for fusing together, using diffusion bonding, micromachine subassemblies which are separately fabricated is described. A first and second micromachine subassembly are fabricated on a first and second substrate, respectively. The substrates are positioned so that the upper surfaces of the two micromachine subassemblies face each other and are aligned so that the desired assembly results from their fusion. The upper surfaces are then brought into contact, and the assembly is subjected to conditions suited to the desired diffusion bonding.
Claims15
A method for fabricating a composite micromachine from micromachine subassemblies, comprising:
- a) forming a first micromachine subassembly on a first substrate, the first micromachine subassembly having a planar mating surface;
- b) forming a second micromachine subassembly on a release layer situated atop a second substrate, the second micromachine subassembly having a planar mating surface;
- c) positioning the first and second substrates so that their planar mating surfaces are facing each other;
- d) aligning the first and second substrates so that the first and second micromachine subassemblies are oriented as desired to form a composite micromachine therefrom;
- e) pressing the two mating surfaces together under conditions suited for diffusion bonding of the two micromachine subassemblies;
- and,
- f) removing the release layer, thereby exposing a released surface of the second micromachine subassembly.
Dependencies are inferred from the claim text.