Semiconductor sensor chip and method for producing the chip, and semiconductor sensor and package for assembling the sensor

Abstract

A sensor chip having a support frame part and sensor structure including at least one displaceable weight part, and a beam part for connecting the weight part to the support frame part. The sensor structure is formed on a silicon substrate through an insulating layer and the insulating layer between the sensor structure and the silicon substrate is removed. The beam part is formed of two parallel beams and the weight part is connected to the support frame part by two parallel beams. At least two semiconductor strain gauges are formed on the surface of the two respective parallel beams. The semiconductor chip may be contained in a package having a main surface for mounting the semiconductor sensor chip formed at a predetermined angle with respect to the surface of a printed circuit board for mounting the package. The main surface is provided with a plurality of terminals along two opposite sides thereof for connecting with input/output terminals of the semiconductor sensor chip. A bottom surface perpendicular to the main surface is provided with a plurality of pins for inserting into mounting holes of the circuit board.

Dependencies are inferred from the claim text.