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US 6,332,268 B1Granted
Method and apparatus for packaging IC chip, and tape-shaped carrier to be used therefor
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsMakoto Imanishi, Yoshifumi Kitayama, Koichi Kumagai, Shinji Kanayama, Yoshinori Wada, Takahiro Yonezawa, Kazushi Higashi
Life of this patent
Estimating the term…
Abstract
An IC chip (2) can be provided to a pre-mount process while being held on a tape-shaped supporting member (5), without being taken out of the tape-shaped supporting member (5).
Claims38
A method of mounting an IC chip to a board, comprising:
- placing an IC chip on a support tape member so that the IC chip is held on the support tape member;
- performing a pre-mount process while the IC chip is held on the support tape member, said performing of the pre-mount process including forming bumps on a rear surface of the IC chip;
- and
- mounting the IC chip having the bumps formed thereon onto a board after said performing of the pre-mount process.
1 more element
An IC chip mounting apparatus comprising:
- a support tape member for holding an IC chip thereon;
- a bump-forming apparatus for forming bumps on a rear surface of the IC chip while the IC chip is held by said support tape member;
- and
- a mounting machine for mounting the IC chips having the bumps formed on the rear surface onto a board.
1 more element
A support tape member for holding an IC chip, comprising:
- a tape-shaped flat base film;
- and
- an adhesive layer formed on said base film for holding the IC chip, wherein said base film and said adhesive layer each have a gas permeability so as to allow the IC chip to be vacuum-sucked through said base film and said adhesive layer and securely held at a predetermined position on said adhesive layer.
A support tape member for holding an IC chip, comprising:
- a support body having a flat bottom surface, having an upper surface including a recess for storing an IC chip, and having a vacuum suction hole formed at a bottom face of said recess;
- and
- an adhesive layer disposed on said bottom face of said recess for holding the IC chip within said recess when the IC chip is sucked through said vacuum suction hole.
Dependencies are inferred from the claim text.