Thin-film resistor, wiring substrate, and method for manufacturing the same
AssigneeNEC Corporation
InventorsAkinobu Shibuya, Koji Matsui
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AssigneeNEC Corporation
InventorsAkinobu Shibuya, Koji Matsui
Estimating the term…
A thin-film resistor that enables a pattern to be simply formed by means of wet etching, that has an excellent resistance temperature characteristic, and that can be easily manufactured, and a method for manufacturing this thin-film resistor, as well as a wiring substrate with this thin-film resistor formed therein. A thin resistor film according to this invention has a structure in which crystal grains deposit in the matrix of amorphous titanium nitride. The thin resistor film is formed on a substrate. The crystal grains includes at least one of crystal titanium nitride and crystal titanium. The thin resistor film can be manufactured using a simple process and can provide a wide range of resistance values with a small tolerance and a temperature coefficient of resistance close to zero.
A thin-film resistor comprising a very thin film of a resistive material deposited over an insulating substrate, said thin film resistor being adapted for use with a supporting substrate having wiring in the form of a pattern of conductive material thereon, said supporting substrate being selected from a group consisting of an Si substrate with insulating layer, a printed circuit board, a built-up circuit board, a ceramic substrate, an organic film, a glass plate, a metal plate or foil with an insulating layer;
A wiring substrate having a pattern of conductive material forming at least wiring supporting substrate, and a thin film titanium nitride resistor formed on an insulator substrate, and said thin titanium nitride film being adapted to be connected to said wiring, said thin film having an electrical resistance which is greater than the resistance of said conductive material forming said wiring.
A wiring substrate comprising an insulator, a pattern of wiring conductors formed on said insulator, and a thin film resistor formed in said wiring pattern, said thin film resistor comprising a thin titanium nitride film having a low conductivity as compared to the conductivity of said wiring, the thin titanium nitride film being interposed between said wiring and said insulator.
Dependencies are inferred from the claim text.