Curing light system useful for curing light activated composite materials

A portable curing light system useful for curing light activated composite materials, the portable curing light system comprising:

• a light source, said light source including
• a primary heat sink, said first heat sink being capable of drawing heat away from a light emitting diode,
• a light emitting semiconductor chip located on said first heat sink, said chip being adjacent to and firmly attached to said primary heat sink so that heat generated by said chip may be drawn away from it by said primary heat sink and conducted to a secondary heat sink from which it may be dissipated,
• a secondary heat sink attached to said first heat sink, said secondary heat sink having a larger volume than said first heat sink and serving to dissipate heat,
• a light source housing including
• a body located about the exterior of said light source, said body serving to contain said light source,
• a light exit located on said body, said light exit being positioned so that light emitted by said light source can exit said housing and travel to a curing surface without first traveling through a light transport apparatus, and
• a curing light housing, said curing light housing serving as a handle for a user of the curing light system to use to hold and manipulate the curing light,
• control circuitry located within said curing light housing, said control circuitry serving to control electrical operation of the curing light, and
• an on and off switch, said on and off switch being located on said curing light housing, said on and off switch serving to selectively provide electrical power to said light source;
• wherein light beams from said chips may exit said light source and travel directly to a curing surface without passing through a light transport apparatus.

A curing light system useful for curing composite materials, the curing light system comprising:

• a light source module including
• a secondary heat sink located in said light source module,
• a plurality of primary heat sinks located on said secondary heat sink, each of said primary heat sinks having a total volume less than that of said secondary heat sink,
• a plurality of chips arranged so that each primary heat sink has one chip located on it, said chips being capable of emitting beams of light, and said chips being electrically connected to each other, said chips being selected from the group consisting of surface emitting laser diode chips, edge emitting laser diode chips, and light emitting diode chips, at least one of said chips having a substrate, said substrate being selected from the group consisting of conductive substrates and insulative substrates, and
• a pair of electrodes in electrical connection with said chips so that said chips may receive electrical power from said electrodes,
• an electronic control module, said electronic control module serving to provide electrical power to said light source, and
• a curing light housing, said curing light housing serving as a cover for parts of the curing light;
• wherein each of said heat sinks serves to draw heat away from said chips;
• wherein light beams from said chips may travel directly to a curing surface without passing through a light transport apparatus.

A curing light system useful for curing composite materials, the curing light system comprising:

• a single solitary light source module including
• a primary heat sink located in said light source module,
• a single solitary light emitting diode chip located on said primary heat sink, said single solitary light emitting diode chip having a substrate, said substrate being selected from the group consisting of electrically insulative substrates and electrically conductive substrates,
• a secondary heat sink located in said light source module, said second heat sink being larger than said primary heat sink, and said primary heat sink being mounted to said secondary heat sink, said heat sinks serving to dissipate heat generated by said chip, and
• a transparent cover protecting said light emitting diode,
• an electronic control module, said electronic control module serving to provide electrical power to said light source;
• wherein dissipation of heat produced by said single light emitting diode chip is achieved by heat transference from said chip to said first heat sink and to said second heat sink without use of a fan;
• and
• wherein light beams from said chips may exit said light source and travel directly to a curing surface without passing through a light transport apparatus.

A curing light system useful for curing composite materials, the curing light system comprising:

• a single light source module including
• a first heat sink located in said light source module,
• a single solitary and lone semiconductor chip capable of emitting light located on said first heat sink, said chip having a substrate, said substrate being selected from the group consisting of electrically insulative substrates and electrically conductive substrates,
• a second heat sink located in said light source module, said second heat sink being larger than said first heat sink, and said first heat sink being mounted to said second heat sink so that heat generated by said chip is dissipated to said first heat sink and to said second heat sink so that cooling may be achieved without use of a fan, and
• a transparent cover protecting said chip, and
• an electronic control module, said electronic control module serving to provide electrical power to said light source;
• wherein light from said chip may travel directly to a curing surface without passing through a light transport apparatus.

A curing light system useful for curing light activated composite materials, the portable curing light system comprising:

• a light source, said light source including
• a heat sink, said heat sink being capable of drawing heat away from a diode laser chip,
• at least one diode laser chip located on said heat sink, said diode laser chip being adjacent to and firmly attached to said heat sink so that heat generated by said diode laser chip may be drawn away by said heat sink,
• a light source housing including
• a body located about the exterior of said light source, said body serving to contain said light source,
• a light exit located on said body, said light exit being positioned so that light emitted by said light source can exit said housing and travel directly to a curing surface, and
• a cover covering said light exit, said cover permitting light emitted from said light source to pass through it and travel to a curing surface,
• said light source housing serving as a handle for a user of the curing light system to use to hold and manipulate the curing light,
• a battery pack locatable within said housing, said battery pack serving to provide electrical power to said light source,
• control circuitry located within said housing, said control circuitry serving to control electrical operation of the curing light,
• an on and off switch, said on and off switch being located on said housing, said on and off switch serving to selectively provide electrical power to said light source;
• wherein said diode laser chip is an edge emitting diode laser chip that emits light from an edge of the chip;
• and wherein said edge emitting diode laser chip is located adjacent an edge of one face of said heat sink so that light emitted from said edge emitting diode laser chip is emitted generally perpendicular to said face of said heat sink.