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US 6,328,642 B1Granted
Integrated pad and belt for chemical mechanical polishing
AssigneeLam Research Corporation
InventorsAnil K. Pant, Rahul Jairath, Kamal Mishra, Saket Chadda, Wilbur C. Krusell
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Abstract
An integrated pad and belt for polishing a surface comprising a belt integrated with a polishing pad that forms a seamless polishing surface.
Claims19
An integrated pad and belt for polishing a surface of a semiconductor substrate, comprising:
- a belt for use on a polishing tool in which said belt is intended for movement across the surface of the semiconductor substrate, said belt comprising a tensile material of sufficient strength to support a force exerted by the semiconductor substrate;
- a polishing pad molded with said belt to form a unitary integrated piece when fabricated onto said belt so that irregularities or unevenness between said polishing pad and said belt are removed, said polishing pad comprising a polishing material for engaging the semiconductor substrate to perform chemical mechanical polishing on the surface of the semiconductor substrate when subjected to a slurry.
An integrated pad and belt for polishing a surface of a semiconductor wafer by performing chemical mechanical polishing, comprising:
- a belt for use on a polishing tool in which said belt is intended for linear movement across the surface of the semiconductor wafer, said belt comprising a tensile material of sufficient strength to support a force exerted by the semiconductor wafer;
- a polishing pad molded with said belt to form a unitary integrated piece when fabricated onto said belt, said polishing pad comprising a polishing material for engaging the semiconductor wafer to perform chemical mechanical polishing on the surface of the semiconductor wafer when subjected to a slurry, said polishing pad having a surface comprising indentations oriented in the direction of the linear movement for channeling the slurry.
A chemical mechanical polishing tool using an integrated pad and belt for polishing a semiconductor wafer, comprising:
- an integrated pad and belt for moving continuously in a linear direction relative to the semiconductor wafer when the semiconductor wafer is engaged onto said integrated pad and belt for performing CMP when subjected to a slurry;
- said integrated pad and belt having an upper surface that does not require a fixed abrasive;
- said integrated Dad and belt comprising:
- a tensile material having sufficient strength to support a force exerted by the semiconductor wafer when driven linearly to perform chemical mechanical polishing on the semiconductor wafer;
- and
- a polishing pad material formed as a unitary integrated piece when fabricated on said tensile material;
- wherein said tensile material comprises an aramid fiber weaved in a direction of intended movement and further supported by a reinforcing material of cotton fiber weaved at an angle from the direction of the intended movement.
4 more elements
An integrated pad and belt for polishing a surface of a semiconductor substrate, comprising:
- a belt for use on a polishing tool in which said belt is intended for movement across the surface of the semiconductor substrate, said belt comprising:
- a tensile material weaved in a direction of intended movement;
- and
- a reinforcing material weaved at an angle from the direction of the intended movement;
- and
- a polishing pad integrated with said belt to form a unitary integrated piece when fabricated, said polishing pad comprising a polishing material for engaging the semiconductor substrate to perform chemical mechanical polishing on the surface of the semiconductor substrate when subjected to a slurry.
3 more elements
An integrated pad and belt for polishing a surface of a semiconductor substrate, comprising:
- a belt for use on a polishing tool in which said belt is intended for movement across the surface of the semiconductor substrate, said belt comprising:
- a tensile material weaved in a direction of intended movement;
- and
- a reinforcing material weaved at an angle from the direction of the intended movement;
- and
- a polishing pad integrated with said belt to form a unitary integrated piece when fabricated, said polishing pad comprising a polishing material for engaging the semiconductor substrate to perform chemical mechanical polishing on the surface of the semiconductor substrate.
3 more elements
Dependencies are inferred from the claim text.