High density connector and method of manufacture
AssigneeBerg Technology, Inc.
InventorsTimothy A. Lemke, Timothy W. Houtz
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AssigneeBerg Technology, Inc.
InventorsTimothy A. Lemke, Timothy W. Houtz
Estimating the term…
Electrical connectors capable of being mounted on circuit substrates (204) by BGA techniques are disclosed. Also disclosed is a method for manufacturing such connectors. There is at least one recess (20, 22, 24) on the exterior side of the connector elements (12). A conductive contact (66) extends from adjacent the interior side into the recess on the exterior side of the housing. A controlled volume of solder paste is introduced into the recess. A fusible conductive element, in the form of solder balls (82) is positioned in the recess. The connector is subjected to a reflow process to fuse the solder ball to the portion of the contact extending into said recess. Contacts are secured in the insulative housing of the connector by deformable sections that minimize stress imposed on the central portions of the contacts to promote uniformity of solder volume.
An electrical connector comprising:
A method for placing an exterior conductive contact on an electrical connector having a base forming an exterior side and an interior side comprising the steps of:
A method of making an electrical connector comprising:
An electrical connector having a base with an exterior side and an interior side and made by steps comprising:
A method of making an electrical connector comprising:
A contact for an electrical connector comprising:
Dependencies are inferred from the claim text.