Microelectronic component of sandwich construction

A microelectronic component having a sandwich construction, comprising:

• a first substrate having a first conductor track plane;
• a plurality of semiconductor chips having first sides electrically connected to said first conductor track plane, and second sides opposite said first sides;
• a second substrate having a second conductor track plane;
• and
• an electrically conductive, flexible adhesive disposed between and electrically connecting said second conductor track plane and said second sides of said plurality of semiconductor chips;
• said second substrate having at least two retaining openings formed therethrough, and said first substrate including at least two retainers for releasably engaging said retaining openings.

An inverter, comprising:

• a first substrate having a first conductor track plane;
• a plurality of semiconductor chips having first sides electrically connected to said first conductor track plane, and second sides opposite said first sides;
• a second substrate having a second conductor track plane;
• an electrically conductive, flexible adhesive disposed between and electrically connecting said second conductor track plane and said second sides of said plurality of semiconductor chips;
• and
• balls disposed in said electrically conductive, flexible adhesive.