Apparatus capable of high power dissipation during burn-in of a device under test

An apparatus for dissipating power from an integrated circuit, comprising:

• a socket capable of receiving and supporting a DUT carrying the integrated circuit, said socket including electrical leads for connecting to corresponding leads on said DUT;
• a heat sink in thermal contact with a cooling medium;
• a heat spreader in thermal contact with said heat sink and with said DUT, said heat spreader including a thermal interface in releasable mechanical and thermal contact with the DUT in the socket, wherein said thermal interface comprises an amount of a low melting point metal contained in a foil skin;
• and
• a heater and a thermocouple, said heater and said thermocouple being adjacent to said thermal interface, said heater being controlled in response to output from said thermocouple.

An apparatus for dissipating power from an integrated circuit, comprising:

• a socket capable of receiving and supporting a DUT carrying the integrated circuit, said socket including electrical leads for connecting to corresponding leads on said DUT;
• a heat sink in thermal contact with a cooling medium;
• a heat spreader in thermal contact with said heat sink and with said DUT, said heat spreader including a thermal interface in releasable mechanical and thermal contact with the DUT in the socket, wherein said thermal interface comprises an amount of a low melting point metal contained in a foil skin, wherein said foil skin has a perimeter that is sealed to said heat spreader;
• and
• a heater and a thermocouple, said heater and said thermocouple being adjacent to said thermal interface, said heater being controlled in response to output from said thermocouple.

An apparatus for dissipating power from an integrated circuit, comprising:

• a socket capable of receiving and supporting a DUT carrying the integrated circuit, said socket including electrical leads for connecting to corresponding leads on said DUT;
• a heat sink in thermal contact with a cooling medium;
• a heat spreader in thermal contact with said heat sink and with said DUT, said heat spreader including a thermal interface in releasable mechanical and thermal contact with the DUT in the socket;
• and
• a heater and a thermocouple, said heater and said thermocouple being adjacent to said thermal interface, said heater being controlled in response to output from said thermocouple.

An apparatus for dissipating power from an integrated circuit, comprising:

• a socket capable of receiving and supporting a DUT carrying the integrated circuit, said socket including electrical leads for connecting to corresponding leads on said DUT;
• a heat sink in thermal contact with a liquid-vapor cooling system;
• a heat spreader in thermal contact with said heat sink and with said DUT, said heat spreader including a thermal interface in releasable mechanical and thermal contact with the DUT in the socket;
• and
• a heater and a thermocouple, said heater and said thermocouple being adjacent to said thermal interface, said heater being controlled in response to output from said thermocouple.