Fixed conductive pin for printed wiring substrate electronics case and method of manufacture therefor
OwnerShiaw-Jong S. Chen, Roger J. Hooeyinventors
Life of this patent
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Abstract
An electronics case, a method of manufacturing the same and a power module incorporating the case. In one embodiment, the case includes: (1) an enclosure including a metal substrate that forms walls of the enclosure and a dielectric material located on inner surfaces of the walls that insulate the substrate from electronics components located within the enclosure and (2) an electrically conductive pin, affixed to a sidewall of the enclosure substrate and extending to without the enclosure, that allows the substrate to be electrically coupled to a structure supporting the case for EMI (electromagnetic interference) shielding or case-grounding purposes.
Claims21
An electronics case, comprising:
- an enclosure including a metal substrate that forms walls of said enclosure and a dielectric material located on inner surfaces of said walls that insulate said substrate from electronics components located within said enclosure;
- and
- an electrically conductive pin connected to said components and extending from inside to without said enclosure, said pin allowing said components and said substrate to be electrically coupled to a structure supporting said case.
A method of manufacturing an electronics case, comprising:
- forming walls of an enclosure with a metal substrate;
- depositing a dielectric material on inner surfaces of said walls to provide insulation for electronics components to be located within said enclosure;
- and
- connecting an electrically conductive pin to said components, said pin extending from inside to without said enclosure and allowing said components and said substrate to be electrically coupled to a structure supporting said case.
A power module, comprising:
- an enclosure including a metal substrate that forms walls of said enclosure and a dielectric material located on inner surfaces of said walls;
- power converter components coupled to said material, said material insulating said substrate from said power converter components;
- and
- an electrically conductive pin connected to said components and extending to from inside without said enclosure, said pin allowing said components and said substrate to be electrically coupled to a structure supporting said power module.
Dependencies are inferred from the claim text.