Electronic package
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorSheng-Tsung Liu
Life of this patent
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Abstract
An electronic package comprises a chip disposed on the upper surface of a substrate. The upper surface of the substrate is provided with a ground ring, a power ring, and a plurality of conductive traces arranged at the periphery of the ground ring and the power ring. The electronic package comprises at least a surface-mountable device connected across the ground ring and the power ring. The present invention is characterized in that the surface-mountable device has at least a bonding region formed on one end contact thereof for bonding to a bonding wire thereby allowing the chip to be electrically connected to the ground ring or power ring directly through the end contact of the surface-mountable device.
Claims6
An electronic package comprising:
- a substrate having opposing upper and lower surfaces, the upper surface of the substrate being provided with a ground ring, a power ring, and a plurality of conductive traces arranged at the periphery of the ground ring and the power ring;
- at least a surface-mountable device connected across the ground ring and the power ring, the surface-mountable device comprising two end contacts and at least a bonding region formed on one of the end contacts;
- a chip disposed on the upper surface of the substrate, the chip having a plurality of bonding pads located about the periphery thereof;
- and
- at least a first bonding wire having one end connected to one of the bonding pads of the chip and the other end connected to the bonding region of the surface-mountable device.
Dependencies are inferred from the claim text.