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US 6,320,755 B1Granted
Retention mechanism for tall PCB components
AssigneeIntel Corporation
InventorsMichael R. Schweers, William J. Hill, Richard Platt
Life of this patent
Estimating the term…
Abstract
An improved assembly for a computer that includes at least two through hole mounted components, which are mounted to a printed circuit board, and a heat resistant strip mounted to the top of each of those components.
Claims11
An assembly for a computer comprising:
- at least two through hole mounted components having a height to width ratio that exceeds 2, which are mounted to a printed circuit board;
- and
- a rigid heat resistant strip mounted to the top of each of those components.
An assembly for a computer comprising:
- at least two through hole mounted capacitors, which are mounted to a printed circuit board;
- and
- a rigid fire resistant plastic strip attached to the top of each of those capacitors by an adhesive material applied to the plastic strip, wherein the strip width exceeds the width of the capacitors and the strip thickness is less than about 10 mm.
A memory card for a server comprising:
- at least three through hole mounted capacitors, which are mounted to the memory card in a substantially linear fashion, each of the capacitors' height to width ratio exceeding 2, and the capacitors each having leads that are at least about 0.6 mm in diameter;
- and
- a rigid fire resistant plastic strip attached to the top of each of those capacitors by an adhesive material applied to the plastic strip.
Dependencies are inferred from the claim text.