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AssigneeDai Nippon Printing Co., Ltd.
InventorsMitsunori Takeda, Eiichi Igarashi, Hideyo Yoshida
Estimating the term…
A frame sheet comprises a core sheet, and oversheets. A recess is formed in the sheet frame. The oversheet is left in the recess in the sheet frame, and an IC carrier is mounted in the recess. The IC carrier is held, adhered to the oversheet left in the recess.
A sheet-framed IC carrier comprising:
Dependencies are inferred from the claim text.
From the US filing history. Foreign family members aren’t listed.
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The record carrier consisting of two or more mechanically separable parts: comprising a first part capable of functioning as a record carrier on…
Constructional details, e.g. mounting of circuits in the carrier: mounting details of integrated circuit chips
On flat or curved insulated base, e.g., printed circuit, etc.: assembling to base an electrical component, e.g., capacitor, etc.
Assembling to base an electrical component, e.g., capacitor, etc.: by inserting component lead or terminal into base aperture
Term ended 18 Jun 2018 (estimated)
USPTO file history isn’t available for this patent, so only indexed dates are shown.
The present invention relates to a small-sized IC carrier with an IC module mounted on, and a method for producing a sheet-framed IC carrier including a sheet frame.
FIG. 11 (A) is a view which explains a conventional IC carrier and a method for using the same.
As shown in FIG. 11(A), an IC carrier 41 has an IC module 42 mounted on, which includes a CPU, memories, electrodes, etc. integrated. The IC carrier 41 is used as, for example, SIMs (Subscriber Identity Module) of portable telephones, etc.
FIG. 1(A) is a plan view of the sheet-framed IC carrier according to a first embodiment of the present invention.
FIG. 1(B) is an A-A sectional view of FIG. 1A.
FIG. 1(C) is a backside view of the sheet-framed IC carrier according to the first embodiment of the present invention.
A First Embodiment of the Sheet-Framed IC Carrier
FIGS. 1(A) to 1(C), FIGS. 5(A) to 5(B), and FIG. 6 are views of the sheet-framed IC carrier according to a first embodiment of the present invention. FIG. 1(A) is a plan view of the sheet-framed IC carrier according to the first embodiment. FIG. 1(B) is a sectional view of the sheet-framed IC carrier according to the first embodiment along A—A in FIG. 1(A). FIG. 1(C)is a backside view of the sheet-framed IC carrier according to the first embodiment of the present invention.
As shown and FIGS. 1(A) to 1(C), the sheet-framed IC carrier 10 comprises a sheet frame 13 with a recess 30(FIG., 9(B) formed in which has a core sheet 21 and oversheets 22. 23 provided on both surfaces of the core sheet 21, and an IC carrier 11 mounted in the recess 30 of the sheet frame 13 and having an IC module 12 mounted thereon. One of the oversheets, e.g., the oversheet 22 is left in the recess 30 of the sheet frame 13, and the IC carrier in the recess is secured, and adhered to the oversheet 22.