Heat sink system
AssigneeFoxconn Precision Components Co., Ltd.
InventorsHsien-Shen Pei, Chung-Yung Sun, Chao-Yang Lee
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AssigneeFoxconn Precision Components Co., Ltd.
InventorsHsien-Shen Pei, Chung-Yung Sun, Chao-Yang Lee
Estimating the term…
A heat sink system assembled within a computer enclosure for dissipating heat away from a heat generating element includes a fan duct, a heat pipe and a fan. The computer enclosure forms an opening. The fan duct is a square hollow shell attached to the computer enclosure, with a surface thereof coupled to the computer enclosure. A first hole is defined in the surface of the fan duct in communication with the opening, thereby communicating with an exterior of the computer enclosure. A second hole is defined in another surface of the fan duct in communication with an interior of the computer enclosure. The heat pipe includes a main body and two attaching portions at opposite ends thereof for being respectively attached to the heat generating element and the fan duct. The main body has a conductive material disposed therein. The fan is assembled within the first hole.
A heat sink system assembled within a computer enclosure for introducing ambient air though an opening of the computer enclosure to dissipate heat away from a heat generating element, comprising:
A heat sink system assembled within a computer enclosure for introducing ambient air to dissipate heat away from a heat generating element, comprising:
Dependencies are inferred from the claim text.