Semiconductor device testing apparatus

A semiconductor device testing apparatus comprising:

• a test tray transported into and out of a test section of said testing apparatus and carrying thereon semiconductor devices to be tested each of which has a plurality of lead terminals;
• and
• a test head positioned in the test section and connected to the respective semiconductor devices during testing thereof;
• wherein
• said test tray having a plurality of device receiving carriers,
• said test head having a plurality of insulator connection boards,
• each of said device receiving carriers has
• its top and bottom both of which are open, and
• a fine conductive wire-embedded member which is mounted to the device receiving carrier so as to close the open bottom thereof to thereby form a pocket for receiving therein the semiconductor device through the open top whereby resting the semiconductor device on the wire-embedded member,
• said fine conductive wire-embedded member comprises
• an insulator plate, and
• a plurality of fine conductive wires embedded in the insulator plate, said fine conductive wires being electrically insulated from each other and extending through the thickness of the insulator plate with the opposite upper and bottom ends thereof exposed at opposed upper and bottom surfaces of the insulator plate,
• the upper end of each of said fine conductive wires exposed at the upper surface of the insulator plate has an upper exposed surface area which is smaller than a bottom area of each of the lead terminals of the semiconductor device contacted to the fine conductive wire-embedded member when rested in the pocket,
• said fine conductive wires are so closely and uniformly embedded in the insulator plate that one or more of the upper ends of the fine conductive wires are capable of contacting to the bottom area of each of the lead terminals of the semiconductor device resting on the fine conductive wire-embedded member,
• each of said insulator connection boards has
• a plurality of conductor pads disposed on an upper surface of the insulator connection board, and
• connection lead wires each connected to each of said conductor pads,
• each of said insulator connection boards is prepared in correspondence to each kind of the semiconductor devices and interchangeably mounted to the test section so as to meet with the semiconductor device of the corresponding kind to be transported in the test section, and
• each of the conductor pads of each said insulator connection board has an upper exposed area which is substantially same as the bottom area of each lead terminal of the corresponding semiconductor device, and disposed at such a corresponding position that each pad opposes to each lead terminal interposing the fine conductive wire-embedded member therebetween,
• whereby said fine conductive wire-embedded member functions as bottom support means for carrying thereon said semiconductor device during transportation thereof and also functions as a socket for contacting the respective lead terminals of said semiconductor device to the corresponding pads during the testing.