Diamond wafer, method of estimating a diamond wafer and diamond surface acoustic wave device
AssigneeSumitomo Electric Industries, Ltd.
InventorsSatoshi Fujii, Yuichiro Seki, Kentaro Yoshida, Hideaki Nakahata, Kenjiro Higaki, Hiroyuki Kitabayashi, Tomoki Uemura, Shin-ichi Shikata
Life of this patent
Estimating the term…