Semiconductor device and method of producing the same

A semiconductor device comprising:

• a heat sink having a chip mounting portion and four bumper portions which are integral with the heat sink,
• a semiconductor chip mounted on the chip mounting portion,
• a resin body of a tetragonal shape sealing the semiconductor chip, and
• a plurality of outer leads electrically connected with the semiconductor chip and protruding from four sides of the resin body,
• wherein the four bumper portions protrude respectively from four corners of the resin body,
• the plurality of outer leads are positioned entirely within a polygon consisting in plan view of extreme tips of the four bumper portions and lines connecting the extreme tips of the four bumper portions,
• the four bumper portions are each thicker and wider than each one of the plurality of outer leads, and
• the heat sink and four bumper portions have an integral flat rear surface protruding from the resin body.

A semiconductor device comprising:

• a heat sink having a chip mounting portion and four bumper portions,
• a semiconductor chip mounted on the chip mounting portion,
• a resin body of a tetragonal shape sealing the semiconductor chip, and
• a plurality of outer leads electrically connected with the semiconductor chip and protruding from four sides of the resin body,
• wherein the four bumper portions protrude respectively from four corners of the resin body,
• the plurality of outer leads are positioned entirely within a polygon consisting in plan view of extreme tips of the four bumper portions and lines connecting the extreme tips of the four bumper portions,
• the four bumper portions each are thicker and wider than each one of the plurality of outer leads, and
• the heat sink and four bumper portions have a monolithic flat rear surface protruding from the resin body.