Semiconductor device, and a manufacturing apparatus for a method of manufacturing the semiconductor device

A semiconductor manufacturing apparatus for forming a film piece to bond a semiconductor chip on a lead frame from a die bonding film in a die bonding process, and sticking the film piece onto the lead frame, comprising:

• film feed means for sequentially feeding the die bonding film;
• and
• film piece forming means for forming a die bonding film piece having a shape and dimension from the die bonding film fed by the film feed means, the film piece forming means including:
• a male blade member which has a cutting blade at circumferential edges on a distal portion and reciprocating along a direction;
• and
• a female blade member which has an opening adjacent the distal portion of the male blade member and a receiving blade corresponding to the cutting blade of the male blade member at an inner circumferential edge of the opening, wherein the male blade member and the female blade member are alterable, so that the shape and dimension of the film piece defined by the cutting blade and the receiving blade can be changed.