Semiconductor device having alternating electrically insulative coated leads
AssigneeConsorzio per la Ricerca sulla Microelectronica nel Mezzogiorno
InventorsMarcantonio Mangiagli, Rosario Pogliese
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Abstract
A package for semiconductor devices is encapsulated in an insulating resin. Multiple conductive leads project from one side of the package. Alternating leads are provided with an insulating coating which projects along a portion of their length. Leads which are not insulated are bent so as to displace them from the plane of the coated leads and space them further away from the coated leads. The bent leads are displaced a sufficient distance to provide a separation in air consistent with spacing standards for high voltage devices.
Claims16
A package for an integrated circuit device, comprising:
- an insulating body containing the integrated circuit device;
- and
- a plurality of conductive leads projecting within a first plane from one side of the insulating body, each of the conductive leads having a tip distal from the insulating body,
- wherein the insulating body extends along alternating ones of the leads covering a portion of their length extending from the insulating body,
- the remaining leads each having a bend at a first distance from the insulating body angling the lead away from the first plane,
- wherein the insulating body extends along the alternating ones of the leads for at least the first distance, such that a distance between all uninsulated portions of any pair of leads is always at least a selected distance.
An integrated circuit device package, comprising:
- an insulating body containing an integrated circuit device and including a projection extending within a first plane;
- a first conductive lead extending through and projecting from the insulating body projection, wherein a tip portion of the first conductive lead lies within the first plane;
- and
- a second conductive lead projecting from the insulating body and including, within a portion extending from the insulating body, a plurality of bends each altering a direction of projection of the second conductive lead, wherein a tip portion of the second conductive lead lies within a second plane substantially parallel to and spaced apart from the first plane,
- wherein the insulating body projection has a length greater than a length of the second conductive lead between the insulating body and the portion of the second conductive lead including the plurality of bends, and
- wherein a distance between exposed portions of the first and second conductive leads exceeds a selected distance.
A connection structure for an integrated circuit device package, comprising:
- a plurality of leads extending from a insulating body and each including a portion extending within a single plane,
- wherein alternating leads within the plurality of leads include an end portion distal from the body which lies within a first plane, and
- wherein intermediate leads between the alternating leads include an end portion distal from the body which lies within a plane spaced apart from the first plane, the intermediate leads including a plurality of bends between the body and the end portion altering a projection of the respective intermediate leads, and
- wherein projections of the insulating body encapsulate the alternating leads for at least a length equal to the length of the intermediate leads between the insulating body and the plurality of bends.
Dependencies are inferred from the claim text.