Rerouted semiconductor device and method of fabrication

A semiconductor device comprising:

• a semiconductor circuit chip having a plurality of metal contact pads;
• a surface protective overcoat comprising at least one electrically insulating layer and covering at least a portion of the circuit surface between said metal contact pads;
• an electrically insulating material having a plurality of thicknesses and widths deposited over at least a portion of the edge sides of said chip;
• a plurality of thin conducting layers including one layer having a plurality of metals, thicknesses and widths contacting said contact pads and having further a portion thereof extending over at least a portion of said insulating material over the edge sides of said chip;
• and
• a plurality of solder bumps positioned onto said plurality of metal layers at a location remote from the circuit contact pads.

A semiconductor device comprising:

• a semiconductor circuit chip having a plurality of metal contact pads;
• a surface protective overcoat comprising at least one electrically insulating layer and covering at least a portion of the circuit surface between said metal contact pads;
• a first plurality of thin conducting layers having a plurality of metals, thicknesses and widths contacting at least portion of said contact pads;
• a first electrically insulating material having a plurality of thicknesses and widths deposited over at least a portion of said first thin metal layers;
• and
• a second plurality of thin conducting layers having a plurality of metals, thicknesses and widths deposited over said first electrically insulting material and contacting at least portion of said contact pads.

An apparatus for the fabrication of said semiconductor device comprising:

• a vacuum chamber which can be repeatedly evacuated and refilled with selected gases;
• means for positioning semiconductor chips on a support;
• said support being rotateable:
• said apparatus including means for precisely orienting said chips so that respective chip sides are precisely aligned for each rotation of said support;
• and
• means for sequentially laser heating selected areas of said chips.