Back to results
US 6,320,254 B1Granted
Plug structure
AssigneeUnited Microelectronics Corp.
InventorsFu-Tai Liou, Andy Chuang
Life of this patent
Estimating the term…
Abstract
A plug structure capable of directly coupling to a packageless bonding pad without having to go through a third conductive medium. The plug structure includes several plugs on a base substrate, such as a printed circuit board or a carrier. A solder is disposed on the plug surface in which the plug can be a cylinder or mushroom-like shape and the solder can be a film or a ball.
Claims11
A interconnect structure suitable for a base substrate, comprising:
- at least a plug on the base substrate wherein the plug is covered by a solder, and
- a chip on which a passivation layer having at least an opening cavity for exposing an external connection underlying the passivation layer is provided,
- wherein the passivation layer has a thickness to shape the opening cavity such that the plug having the solder thereon is snapped into the opening cavity for electrically contact with the exposed external connection.
A interconnect structure suitable for a base substrate, comprising:
- at least a plug on the base substrate, wherein the plug is covered by a solder wherein a width increases on approaching an upper surface of the plugs and decreases on approaching the base substrate, wherein the plug is snapped onto a packageless bond pad;
- and
- a chip on which a passivation layer having at least an opening cavity for exposing an external connection underlying the passivation layer is provided,
- Wherein the passivation layer has a thickness to shape the opening caity such that the plug having the solder thereon is snapped into the opeing cavity for electrically contact with the exposed external connection, and
- Wherein the solder fits the opening cavity after thermal treatment.
2 more elements
Dependencies are inferred from the claim text.