Stackable package for an integrated circuit
AssigneeAmkor Technology, Inc.
InventorThomas P. Glenn
Life of this patent
Estimating the term…
Abstract
Package embodiments for integrated circuits or other electronic devices are disclosed, along with methods of making and interconnecting the packages. The packages include a package body formed of molded encapsulant. Leads extend from a first end that is embedded at a lower surface of the package body second end that is outside the package body. The leads are bent up the sides of the package and over the top surface of the package. The packages have mounting keys so that a plurality of packages may be precisely stacked one on top of the other. Abutting leads of the stacked packages may be electrically interconnected. The packages also may be placed next to each other so that their leads abut and may be electrically interconnected.
Claims33
A package for an electronic device comprising:
- a package body formed of an encapsulant material, said package body having a first surface, an opposite second surface, and side surfaces extending vertically between said first and second surfaces, wherein said package body includes an integral first member protruding from the first or second surfaces of the package body, and the other of the first or second surfaces of the package body includes a hole shaped to receive another member shaped similar to said first member;
- a plurality of leads, each said lead having an embedded first portion at the second surface of the package body, a second portion extending vertically adjacent to a side surface of the package body, and a third portion extending over the first surface of the package body, wherein a first surface of said first portion of each lead is exposed at the second surface of the package body;
- and
- an electronic device within said package body and electrically connected to one or more of said leads.
A package for an electronic device comprising:
- a package body formed of an encapsulant material, said package body having a first surface and an opposite second surface, wherein said package body includes an integral first member protruding from the first or second surfaces of the package body, and the other of the first or second surfaces includes a hole shaped to receive another member shaped similar to said first member;
- a plurality of leads each partially embedded in said package body, and
- an electronic device within said package body and electrically connected to one or more of said leads.
The package of claimed 20, wherein the embedded portion of each lead includes a lower surface that is exposed at one of the first or second surfaces of the package body and a recessed surface immediately adjacent to the exposed surface, said recessed surface being covered by said encapsulant material.
A module of electrically interconnected electronic device packages comprising:
- at least first and second electronic device packages stacked one on top of the other, each said package comprising a package body formed of an encapsulant material, said package body having a first surface, an opposite second surface, and side surfaces extending vertically between said first and second surfaces, an electronic device within said package body, and a plurality of leads, each said lead having an embedded first portion at the second surface of the package body, a second portion extending vertically adjacent to a side surface of the package body, and a third portion extending over the first surface of the package body, and wherein a first surface of said first portion of each lead is exposed at the second surface of the package body,
- wherein a portion of at least some of said plurality of leads of said first package are juxtaposed with and electrically connected to a portion of at least some of the leads of said second package, and
- wherein said package body of at least one of the first and second packages includes an integral member protruding from the first or second surface of the package body, and the package body of at least the other of the first and second packages includes a hole in the first or second surface of the package body, and the member of the at least one package is within the hole of the other package.
A module of electrically interconnected electronic device packages comprising:
- at least first and second electronic device packages stacked one on top of the other, each comprising a package body formed of an encapsulant material, said package body having a first surface and an opposite second surface, wherein an electronic device is within said package body, and a plurality of leads that are partially embedded in the package body,
- wherein said package body of at least one of the first and second packages includes an integral member protruding from the first or second surface of the package body, and the first or second surfaces of the package body of the other of the first and second packages includes a hole, and the member of the at least one package is within the hole of the other package, and
- wherein at least a portion of some of said plurality of leads of said first package are juxtaposed with and electrically connected to a portion of at least some of the leads of said second package.
Dependencies are inferred from the claim text.