Semiconductor package and process for manufacturing the same

Abstract

The present invention provides a semiconductor package, the package comprising: a base substrate having a perforation formed therein, the perforation including a bottom and the base substrate including a backface; an electrode portion secured to the backface of the base substrate and disposed on the bottom of the perforation; a semiconductor device electrically connected to the electrode portion and disposed on the backface of the base substrate; a sheet elastic body interposed between the semiconductor device and the electrode portion; and leveling means between the sheet elastic body and the electrode portion for eliminating gaps along the electrode portion. In the semiconductor package neither deformation nor cracks of the package will be produced even if heat history is applied during packaging and the package density can be improved. The present invention further provides a process for the production of the semiconductor package.

Dependencies are inferred from the claim text.