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AssigneeSeiko Instruments Inc.
InventorsHiroaki Takasu, Noritoshi Ando, Yoshikazu Kojima, Kazunari Sugiura, Michiaki Yazawaw
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In a semiconductor integrated circuit device having laser-trimmable fuses and a trimming position pattern, in order to increase trimming accuracy and reduce the size of the positioning pattern, the fuses and the positioning pattern are formed using the same thin film. The trimming positioning pattern has an abrupt boundary between a high light reflectivity region and a low reflectivity region so that light reflectivity varies abruptly. To further reduce size, the trimming positioning pattern can be formed in pad areas of a integrated circuit chip or placed at intersections between scribe lines in a wafer.
A semiconductor device comprising:
An integrated circuit formed on a substrate and having a thin film trimmable fuse and a trimming positioning pattern for positioning a cutting beam for cutting the fuse, the trimming positioning pattern comprising:
An integrated circuit formed on a substrate and having a thin film trimmable fuse and a trimming positioning pattern for positioning a cutting beam for cutting the fuse, the trimming positioning pattern comprising:
A semiconductor device comprising:
Dependencies are inferred from the claim text.