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AssigneeInternational Business Machines Corporation
InventorsChristian Bergeron, Raymond Lord, Mario Racicot
Estimating the term…
Circuit chips, such as known good die (KGD) chips, are removed from an assembly including a plurality of circuit chips attached to at least one chip carrier, or substrate. The substrate is held within a top plate with the circuit chips positioned within successive chip cavities within a bottom plate. Each chip cavity includes a load surface separated by a cascade effect pitch with respect to adjacent chip cavities. A cascade effect shear force is sequentially applied to the circuit chips to remove them from the substrate. The chips may be heated to a temperature facilitating shear within a temperature range at which solder connections are solid, and the chips further heated following disassembly to a temperature at which the solder is liquid to facilitate reforming the solder for subsequent attachment of the chip into an electronic device.
An apparatus for removing circuit chips from an assembly including a plurality of chips each attached to a respective substrate by solder material, comprising:
A method for removing a plurality of circuit chips from an assembly wherein each of said chips is attached to a respective substrate by solder material, said chips having interconnection pads thereon, said method comprising the steps of:
Dependencies are inferred from the claim text.