Method and apparatus of fabricating perforated plate
AssigneeFujitsu Limited
InventorsMasayuki Kitajima, Yutaka Noda, Yoshitaka Muraoka, Fumihiko Tokura
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Abstract
A method of forming bumps onto a chip having electrodes. The method includes the use of a template having through-holes arranged in correspondence to the electrodes of the chip. The template holds conductive balls to be formed into bumps to the template at the through-holes by vacuum suction. The through-holes of the template are formed by a laser, by supporting a glass plate on a support table having cavities and irradiating the plate with laser beams at the position of the cavities.
Claims9
A method of fabricating a perforated plate, said method comprising the steps of:
- supporting a plate to be processed and including an inorganic material on a movable support table having a flat surface and a plurality of cavities having bottoms;
- and
- irradiating the plate to be processed with a laser beam at the positions of said cavities having bottoms to form through-holes.
An apparatus of fabricating a perforated plate, said apparatus comprising:
- a movable stage;
- a support table placed on said movable stage, said support table having a flat surface on which a plate to be processed can be supported, and a plurality of cavities in said flat surface, said cavities having bottoms;
- and
- a laser irradiating means for irradiating a laser beam to the plate to be processed at the position of said cavities to form through-holes.
Dependencies are inferred from the claim text.