Plasma enhanced wire bonder
AssigneeGeoMat Insights, LLC
InventorRonald J. Barnett
Life of this patent
Estimating the term…
Abstract
A method and apparatus for simultaneously cleaning and bonding a wire to a bonding surface is presented. In accordance with the invention, a gas is energized to form a plasma, which is then directed in a directional pressurized flow at the wire and bonding surface to form a dynamic plasma cleaning chamber bubble around the portion of the wire and bonding surface that are to be bonded together, and then the respective portions of the wire and bonding surface are bonded together within the plasma cleaning chamber bubble.
Claims20
A plasma enhanced wire bonder for bonding a wire to a bond surface, comprising:
- a bonding device which bonds said wire to said bond surface;
- a plasma gun which applies a pressurized directional flow of plasma directed at said wire and said bond surface to simultaneously heat and clean said wire and said bond surface during bonding of said wire to said bond surface.
A method for bonding a wire to a bonding surface, said method comprising:
- energizing a gas to form a plasma;
- directing said plasma in a directional pressurized flow at said wire and said bonding surface, so as to form a plasma cleaning chamber bubble around the portion of said wire and said bonding surface that are to be bonded together to simultaneously heat and clean said wire and said bond surface during bonding of said wire to said bond surface;
- and
- bonding together said respective portions of said wire and said bonding surface while said plasma cleaning chamber bubble exists.
Dependencies are inferred from the claim text.