Reflow selective shorting
AssigneeRockwell Automation Technologies, Inc.
InventorsFrancis R. Byle, Kevin M. McCoy, Todd J. Zorn
Life of this patent
Estimating the term…
Abstract
A bridge structure is utilized on a circuit board. The bridge structure includes a first element, a second element and a gap between the first element and a second element. Soder paste is capable of flowing when the circuit board is heated, such that the paste on the first element comes into contact with paste on the second element. The paste solidifies when cooled such that solidified paste serves to connect the first element and the second element. The first and second elements can be L-shaped.
Claims20
A bridge structure on a circuit board, said bridge structure comprising:
- a first conductive trace element being entirely on a top surface of the circuit board;
- a second conductive trace L-shaped element being entirely on a top surface of the circuit board spaced near said first conductive trace element;
- a gap lying between said first conductive trace element and said second L-shaped conductive trace element;
- solder paste placed upon the first conductive trace element and the second L-shaped conductive trace element,
- said solder paste capable of flowing when said circuit board is heated such that the solder paste on said first conductive trace element comes into contact with the paste on the second L-shaped conductive trace element, wherein the first conductive trace element consists of an L-shape and consisting of a first member and a second member, the first conductive trace member being approximately perpendicular to the second member, wherein the second L-shaped conductive trace element consists of a third member and a fourth member, the third member being perpendicular to the fourth member, the first conductive trace element being inverted with respect to the second L-shaped conductive trace element, said paste solidifying when said circuit board is cooled such that the solidified paste serves to connect said first element and said L-shaped conductive trace second element to form an electrical connection between said first conductive trace element.
A bridge structure on a circuit board, said bridge structure comprising:
- a first element entirely on a top surface of the circuit board;
- a second element entirely on a top surface of the circuit board;
- a gap between said first element and said second element;
- and
- means for connecting said first element and said second element via a reflow solder technique so electricity is capable of flowing across said bridge structure, wherein the first element consists of a first L-shape and consists of essentially a first member and second member, the first member being approximately perpendicular to the second member, wherein the second element consists of a second L-shape and consists essentially of a third member and a fourth member, the third member being perpendicular to the fourth member.
A circuit board including a first element entirely on a top surface of the circuit board and a second element entirely on a top surface of the circuit board the first element and the second element being separated by a gap, the first element being coupled to the second element by a method comprising:
- placing a solder paste on the first element and the second element, the first element consisting of a first L-shape and consisting of a first member and second member, the first member being perpendicular to the second member, the second element consisting of a second L-shape and consisting of a third member and a fourth member, the third member being perpendicular to the fourth member;
- heating said circuit board such that said paste flows over said gap and connects said first element and said second element;
- and
- cooling said circuit board such that said paste solidifies.
Dependencies are inferred from the claim text.