Layered printed-circuit-board and module using the same
AssigneeOki Electric Industry Co., Ltd.
InventorAkira Sakamoto
Life of this patent
Estimating the term…
Abstract
A printed circuit board, on which an electronic component with leads is mounted, includes a first conductive layer; an insulating layer formed on the first conductive layer; a second conductive layer formed on the insulating layer; and a buffer region. The second conductive layer is provided with pads to be connected to the leads of the electronic component. The buffer region has a thermal expansion coefficient lower than the first conductive layer and is arranged between the first conductive layer and the insulating layer to ease thermal expansion of the first conductive layer.
Claims28
A printed circuit board comprising:
- a first conductive layer;
- an insulating layer formed on said first conductive layer;
- a second conductive layer formed on said insulating layer and having pads to be connected to leads of a semiconductor package;
- and
- a buffer region in said first conductive layer, said buffer region having a thermal expansion coefficient lower than a thermal expansion coefficient of said first conductive layer so as to allow for thermal expansion of said first conductive layer.
A printed circuit board comprising:
- a first conductive layer;
- a buffer layer formed on an entirety of a surface of said first conductive layer, said buffer layer having a thermal expansion coefficient lower than a thermal expansion coefficient of said first conductive layer so as to allow for thermal expansion of said first conductive layer
- an insulating layer formed on said buffer layer;
- and
- a second conductive layer formed on said insulating layer and having pads to be connected to leads of a semiconductor package.
An apparatus comprising:
- a semiconductor package including a semiconductor chip and leads extending therefrom;
- a printed circuit board, said semiconductor package being mounted on said printed circuit board, said printed circuit board including:
- a first conductive layer;
- an insulating layer formed on said first conductive layer;
- a second conductive layer formed on said insulating layer and having pads electrically connected to said leads of said semiconductor package;
- and
- a buffer region in said first conductive layer, said buffer region having a thermal expansion coefficient lower than a thermal expansion coefficient of said first conductive layer so as to allow for thermal expansion of said first conductive layer.
An apparatus comprising:
- a semiconductor package including a semiconductor chip and leads extending therefrom;
- a printed circuit board, said semiconductor package being mounted on said printed circuit board, said printed circuit board including:
- a first conductive layer;
- a buffer layer formed on an entirety of a surface of said first conductive layer, said buffer layer having a thermal expansion coefficient lower than a thermal expansion coefficient of said
- first conductive layer so as to allow for thermal expansion of said first conductive layer an insulating layer formed on said buffer layer;
- and
- a second conductive layer formed on said insulating layer and having pads electrically connected to said leads of said semiconductor package.
Dependencies are inferred from the claim text.