Flexible wiring substrate and its manufacturing method
AssigneeCasio Computer Co., Ltd.
InventorHirokazu Saito
Life of this patent
Estimating the term…
Abstract
Predetermined wiring of copper is formed on the upper surface of an elongated base film in a wiring forming area as a width-directional central portion of the base film. Further, band-shaped first reinforcing layers of copper are formed on width-directional opposite portions of the upper surface of the base film. As a result, even if the base film has a relatively thin thickness, portions of the base film near sprocket holes can be made to have a substantially desired strength. To keep the first reinforcing layers out of contact with the pins of a transfer pin roller, opening slightly larger than the sprocket holes are formed in the first reinforcing layers.
Claims30
A carrier tape for connecting an integrated circuit to an external circuit, comprising:
- an elongated base film having a plurality of holes;
- a wire formed on one surface of the base film between a pair of holes included in the plurality of holes;
- and
- a reinforcing layer formed on the one surface of the base film, and having an opening corresponding to the hole of the base film, the opening having a side parallel to the longitudinal direction of the base film and exposing a side portion of the one surface of the base film, the side portion located at the side of the opening.
A carrier tape for connecting an integrated circuit to an external circuit, comprising:
- an elongated base film having a plurality of holes;
- a wire formed on one surface of the base film between a pair of holes included in the plurality of holes;
- and
- reinforcing layers formed on the one surface of the base film, and having openings corresponding to the holes of the base film, each of the openings having a side parallel to the longitudinal direction of the base film and exposing a side portion of the one surface of the base film, the side portion located at the side of the opening.
A carrier tape for connecting an integrated circuit to an external circuit, comprising:
- an elongated base film having a plurality of first holes and a plurality of second holes;
- a wire formed on one surface of the base film between a pair of first holes included in the plurality of first holes;
- and
- a reinforcing layer formed on the one surface of the base film, and having an opening corresponding to one of the first holes of the base film, the opening having a side parallel to the longitudinal direction of the base film and exposing a side portion of the one surface of the base film, the side portion located at the side of the opening.
A carrier tape for connecting an integrated circuit to an external circuit, comprising:
- an elongated base film having a plurality of holes;
- a wire formed on one surface of the base film between a pair of holes included in the plurality of holes;
- and
- a reinforcing layer formed on the one surface of the base film, and having an opening corresponding to one of the pair of the holes of the base film, the opening having a side parallel to the lateral direction of the base film and exposing a side portion of the one surface of the base film, the side portion located at the side of the opening.
A carrier tape for connecting an integrated circuit to an external circuit, comprising:
- an elongated base film having a plurality of holes;
- a wire formed on one surface of the base film between a pair of holes included in the plurality of holes;
- and
- reinforcing layers having walls corresponding to the holes of the base film formed on the one surface of the base film, each of the walls separated from the corresponding hole of the base film with a predetermined distance therebetween.
A carrier tape for connecting an integrated circuit to an external circuit, comprising:
- an elongated base film having a plurality of carrier-tape-forming areas arranged parallel to each other in a direction of a width of the base film, the base film having a plurality of holes formed in width-directionally opposite portions of each of the carrier-tape-forming areas;
- a plurality of wires each formed on one surface of the base film in a substantially width-directional central portion of a corresponding one of the carrier-tape-forming areas;
- and
- reinforcing layers formed on the one surface of the base film, and having openings corresponding to the holes of the base film, each of the openings having one-side parallel to the longitudinal direction of the base film and exposing one-side portion of the one surface of the base film, the one-side portion located at the one-side of the opening.
A method of manufacturing a carrier tape for connecting an integrated circuit to an external circuit, comprising:
- forming a wire on a width-directionally central portion of one surface of an elongated base film having a plurality of holes formed in width-directional opposite portions thereof;
- and
- forming reinforcing layers on the one surface of the base film, the reinforcing layers having openings corresponding to the holes of the base film, each of the openings having one-side parallel to the longitudinal direction of the base film and exposing one-side portion of the one surface of the base film, the one-side portion located at the one-side of the opening.
A method of manufacturing a carrier tape for connecting an integrated circuit to an external circuit, comprising:
- forming a wire on a width-directionally central portion of one surface of an elongated base film having a plurality of holes formed in width-directional opposite portions thereof;
- and
- forming reinforcing layers on the one surface of the base film, the reinforcing layers having openings corresponding to the holes of the base film, each of the openings having at least one-side parallel to the lateral direction of the base film and exposing at least one-side portion of the one surface of the base film, the one-side portion located at the one-side of the opening.
A method of manufacturing a carrier tape for connecting an integrated circuit to an external circuit, comprising:
- forming wires on one surface of an elongated base film in a central portion of each of carrier-tape-forming areas which are each defined on the one surface and have holes formed in width-directionally opposite portions thereof;
- and
- forming reinforcing layers on the one surface of the base film, the reinforcing layers having openings corresponding to the holes of the base film, each of the openings having at least one-side parallel to the lateral direction of the base film and exposing one-side portion of the one surface of the base film, the one-side portion located at the one-side of the opening.
Dependencies are inferred from the claim text.