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US 6,320,129 B1Granted
Method for making electrode of polymer composite
AssigneeIndustrial Technology Research Institute
InventorsShu-Chin Chou, Kun-Huang Chang, Chen-Ron Lin
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Abstract
This invention provides a method for making an electrode film for a composite polymer material. A composite plating method is used to form a conductive plate film with microrough surface of 0.01 to 100 microns which will be adhered to a composite polymer material, enhances the adhering performance and reduces the interface electrical resistance.
Claims29
A method for making a conductive polymer composite having an electrode, comprising the steps of:
- providing a conductive polymer element;
- utilizing a composite plating method to form an electrode film having a microrough surface on a conductive base;
- and
- pressing the electrode onto the conductive polymer element;
- wherein the composite plating method comprises the steps of:
- preparing a composite plating solution containing a metal plating solution and insoluble particles;
- placing a base material on a cathode of a plating apparatus;
- placing a conductive base on an anode of a plating apparatus;
- and
- conducting plating to form the microrough surface of the electrode;
- further wherein the composite plating solution is prepared using the following steps:
- gradually adding the insoluble particles into the plating solution;
- applying ultrasonic wave to keep the insoluble particles segregated from each other;
- circulating and stirring the composite plating solution.
11 more elements
A method for making a conductive plating film having a microrough surface, comprising the steps of:
- preparing a plating tank having a composite plating solution containing a metal plating solution and insoluble particles;
- placing a base material on a cathode of a plating apparatus;
- placing a conductive base on an anode of a plating apparatus;
- and
- conducting plating to form the microrough surface of the electrode on the base material said mircorough having a surface roughness ranging from 0.01 to 100 microns;
- wherein the composite plating solution is prepared using the following steps:
- gradually adding the insoluble particles into the plating solution;
- applying ultrasonic wave to keep the insoluble particles segregated from each other;
- circulating and stirring the composite plating solution.
6 more elements
Dependencies are inferred from the claim text.