Package comprising low application temperature hot melt adhesive comprising ethylene α-olefin

A package comprising at least one substrate bonded with a hot melt adhesive comprising:

• a) at least one homogeneous linear or substantially linear interpolymer of ethylene with at least one C3-C20 α-olefin interpolymer having a density from 0.850 g/cm3 to 0.895 g/cm3;
• b) up to about 60 wt-% of at least one tackifying resin;
• and
• c) up to about 40 wt-% of at least one wax;
• wherein the hot melt adhesive has a viscosity of less than 5000 centipoise at 150° C.

A package comprising at least one substrate bonded with a hot melt adhesive comprising:

• a) at least one homogeneous linear or substantially linear interpolymer of ethylene with at least one C3-C20 α-olefin interpolymer having a density from 0.850 g/cm3 to 0.895 g/cm3;
• b) up to about 60 wt-% of at least one tackifying resin;
• and
• c) up to about 40 wt-% of at least one wax;
• wherein the homogeneous linear or substantially linear interpolymer of the adhesive has a viscosity from 2000 centipoise to 18000 centipoise.

A package comprising at least one substrate bonded with a hot melt adhesive comprising:

• a) at least one homogeneous linear or substantially linear interpolymer of ethylene with at least one C3-C20 α-olefin interpolymer having a density less than 0.875 g/cm3;
• b) up to about 60 wt-% of at least one tackifying resin;
• and
• c) up to about 40 wt-% of at least one wax.

A package comprising at least one substrate bonded with a hot melt adhesive comprising:

• a) at least one homogeneous linear interpolymer of ethylene with at least one C3-C20 α-olefin interpolymer having a density from 0.850 g/cm3 to 0.895 g/cm3;
• b) up to about 60 wt-% of at least one tackifying resin;
• and
• c) up to about 40 wt-% of at least one wax;
• wherein the melt index of the interpolymer of the adhesive ranges from 500 g/10 min. to 2000 g/10 min.

A carton, case or tray utilizing a hot melt adhesive comprising:

• (a) at least one homogeneous linear or substantially linear interpolymer of ethylene and 1-octene wherein the 1-octene comonomer content of the interpolymer is greater than 31% by weight in the polymer as measured by NMR in accordance with ASTM D-5017, the number average molecular weight of the interpolymer is no more than 11,000 having a density from 0.850 gm/cm3 to 0.895 gm/cm3;
• (b) up to about 60 wt % of at least one tackifying resin;
• and
• (c) up to about 40 wt % of at least one wax;
• wherein the hot melt adhesive has a viscosity of less than 5,000 centipoise at 150° C. and can be applied at temperatures of less than about 150° C.