Integrated electronic micromodule and method for making same
AssigneeInside Technologies
InventorsJacek Kowalski, Didier Serra, Frédéric Bertholio
Life of this patent
Estimating the term…
Abstract
An electronic micromodule includes a support wafer, and an integrated circuit chip on the support wafer. The integrated circuit chip includes electrical connector areas, and at least one insulation layer is on the support wafer and the integrated circuit chip. The insulation layer includes openings to the electrical connector areas. At least one flat winding defining a coil is on the insulation layer and is connected to the electrical connector areas. A conducting material is in in each of the openings through the insulation layer for connecting the coil to the electrical zconnector areas.
Claims26
A method for making at least one electronic micromodule comprising a support wafer and an integrated circuit chip thereon, the integrated circuit chip comprising a plurality of electrical connector areas and at least one coil connected to the plurality of electrical connector areas, the method comprising:
- attaching the integrated circuit chip to the support wafer;
- forming at least one insulation layer on the support wafer and the integrated circuit chip;
- forming a plurality of openings through the at least one insulation layer to the plurality of electrical connector areas;
- forming at least one winding defining a coil on the at least one insulation layer;
- and
- connecting the coil to the plurality of electrical connector areas.
An electronic micromodule comprising:
- a support wafer;
- an integrated circuit chip on said support wafer, said integrated circuit chip comprising a plurality of electrical connector areas;
- at least one insulation layer on said support wafer and said integrated circuit chip, said at least one insulation layer including a plurality of openings to said plurality of electrical connector areas;
- and
- at least one winding defining a coil on said at least one insulation layer and being connected to said plurality of electrical connector areas.
A hybrid electronic micromodule comprising:
- a support wafer comprising a plurality of contact pads on a front side thereof;
- an electronic micromodule on a rear side of said support wafer and comprising
- an integrated circuit chip comprising a plurality of electrical connector areas,
- at least one insulation layer on the rear side of said support wafer and said integrated circuit chip, said at least one insulation layer including a plurality of first openings to said plurality of electrical connector areas and a plurality of second openings to said plurality of contact pads, and
- at least one winding defining a coil on said at least one insulation layer and being connected to said plurality of electrical connector areas via said plurality of first opening,
- said electronic micromodule having a contact operating mode via said plurality of contact pads, and a contactless operating mode via said coil.
A contactless integrated circuit comprising:
- an electronic micromodule comprising
- a support wafer;
- an integrated circuit chip on said support wafer, said integrated circuit chip comprising a plurality of electrical connector areas;
- at least one insulation layer on said support wafer and said integrated circuit chip, said at least one insulation layer including a plurality of openings to said plurality of electrical connector areas;
- and
- at least one winding defining an antenna circuit on said at least one insulation layer and being connected to said plurality of electrical connector areas;
- a demodulator connected to said antenna circuit for reception of digital data;
- a modulator connected to said antenna circuit for transmission of the digital data;
- and
- a processor connected to said demodulator and to said modulator.
Dependencies are inferred from the claim text.