Method of making light emitting diode
AssigneeUnited Epitaxy Company, Ltd.
InventorsTzer-Perng Chen, Chih-Sung Chang, Kuang-Neng Yang
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Abstract
A method of making a light emitting diode (LED) is disclosed. An emitting light absorbed by a substrate can be prevented by using a metal with high conductivity and high reflectivity and a bonding process can be produced at a lower temperature and a better welding performance can be obtained by using a solder layer could be fused into a liquid-state. Furthermore, an industry standard vertical LED chip structure is provided and only requiring a single wire bond that results in easy LED assembly and the manufacture cost can be reduced. An LED chip size can be greatly reduced and with good heat dissipation, therefore the LED has better reliability performance and can be operated at much higher current.
Claims12
A method for manufacturing a light emitting diode, comprising:
- providing an epitaxial structure has a plurality of III-V compound semiconductor layers to generate light with injection current;
- providing a silicon substrate has a first ohmic contact metal layer on one side and a second ohmic contact metal layer on the other side;
- and
- providing a low-temperature conductive solder layer for bonding the epitaxial structure to the silicon substrate.
A method for manufacturing a light emitting diode, comprising:
- providing an epitaxial structure has a plurality of III-V compound semiconductor layers to generate light with injection current, wherein the epitaxial structure stacked sequentially comprises a first conductive type substrate, a first conductive type etching stop layer, a first conductive type lower cladding layer, an active layer, a second conductive type upper cladding layer and a second conductive type surface cap layer;
- providing a silicon substrate has a first ohmic contact metal layer on one side and a second ohmic contact metal layer on the other side;
- forming a third ohmic contact metal layer with high reflectivity on the second conductive type surface cap layer;
- providing a low-temperature conductive solder layer for bonding the epitaxial structure to the silicon substrate, wherein a material of the low-temperature conductive solder layer is selected from a group composed of AuSn alloy, PbSn alloy and In;
- removing the first conductive type substrate and the first conductive type etching stop layer;
- and
- forming a fourth ohmic contact metal layer to cover the lower cladding layer.
Dependencies are inferred from the claim text.