Single-layer autorouter
AssigneeAdvanced Micro Devices, Inc.
InventorsAlexander Tain, Joan L. Tan, Valerie Vivares
Life of this patent
Estimating the term…
Abstract
A novel method of automatically routing connections from bumps on a die to package pins in an advanced IC package such as a flip-chip package. The method involves creating graphic presentations of the die having the bumps and the package having pins, and placing the graphic presentation of the die into the graphic presentation of the package. If a netlist identifying interconnections between the bumps and the pins is available, the best route from a bump on the die to a corresponding package pin identified in the netlist is generated in accordance with preset requirements. If the netlist is not available, the best route from the bump to any package pin is generated in accordance with the preset requirements.
Claims8
A method of automatically routing connections from bumps on a die to package pins in an IC package, the method comprising the steps of:
- creating graphic presentations of the die having the bumps and the package having pins,
- placing the graphic presentation of the die into the graphic presentation of the package,
- determining whether a netlist identifying interconnections between the bumps and the pins is available, and
- if the netlist is available, generating a route from a bump on the die to a corresponding package pin identified in the netlist in accordance with preset requirements.
Dependencies are inferred from the claim text.