Lead frame, semiconductor package having the same and method for manufacturing the same

A method for manufacturing a semiconductor device comprising the steps of:

• forming leads at one surface side of a metal laminate plate comprising plural layers containing an etching stopper layer by the surface layer itself or another metal layer further formed on the surface layer, each lead being connected to an electrode of a semiconductor element at one end portion thereof and to an external electrode at the other end portion thereof;
• forming an insulating film at said one surface side so as to have said leads embedded therein and have holes for forming the external electrodes;
• forming external terminals in said holes so that said external terminals are connected to the other end portions of said leads;
• forming reinforcing portions on suspending portions;
• selectively etching said laminate plate from the surface side opposite to said one surface to form an outer ring having said suspending portions;
• and
• connecting said one end portions of said leads to said electrodes of said semiconductor element.