Method for manufacturing a thermoelectric semiconductor material or element and method for manufacturing a thermoelectric module
AssigneeKomatsu Ltd.
InventorsLee Yong Hoon, Takeji Kajiura
Life of this patent
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Abstract
To provide a method for manufacturing a thermoelectric semiconductor material or a thermoelectric semiconductor element and method for manufacturing a thermoelectric module effective in improving thermoelectric performance. The thermoelectric semiconductor material is manufactured by producing a laminated body of thin powders manufactured by a quenching roller method, and compressing simultaneously the side surfaces of the laminated body using a secondary punch.
Claims6
A method for manufacturing a thermoelectric semiconductor material or a thermoelectric semiconductor element comprising the steps of laminating thin powders, which comprise a plurality of stratified structure compound grains, in the film thickness direction of the thin powders, and compressing a laminated body thus obtained, wherein
- the compression is applied from a direction which is orthogonal with the laminated direction of the thin powders.
A method for manufacturing a thermoelectric semiconductor material or element comprising:
- a step of producing thin powders which comprise a plurality of stratified structure compound grains and in which the C surface of the stratified-structure compound is upright orientated along the film thickness direction;
- a step of laminating a plurality of layers of the thin powders in the film thickness direction to form a laminated body;
- a first compressing step of compressing the laminated body along the laminated direction of the thin powders;
- and
- a second compressing step of further compressing the laminated body from a direction which is orthogonal to the compressing direction of the first compressing step.
A method for manufacturing a thermoelectric module comprising:
- a step of producing thin powders which comprise a plurality of stratified structure compound grains and in which the C surface of the stratified-structure compound is upright orientated along the film thickness direction;
- a step of laminating a plurality of layers of the thin powders in the film thickness direction to form a laminated body;
- a first compressing step of compressing the laminated body along the lamination axis of the thin powders;
- a second compressing step of further compressing the laminated body from a direction which is orthogonal to the compressing direction of the first compressing step;
- and
- a step of forming a pair of terminals on the upper surface and lower surface of a P-type and an N-type laminated body obtained by the second compressing step so as to be positioned on the axis of lamination passing through the laminated body.
Dependencies are inferred from the claim text.