Photosensitive polyimide precursor and its use for pattern formation
AssigneeHitachi Chemical Company, Ltd.
InventorsHaruhiko Kikkawa, Fumio Kataoka, Issei Takemoto, Jun Tanaka, Keiko Isoda, Shunichiro Uchimura, Makoto Kaji, Minoru Sugiura
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Abstract
A polyimide precursor having repeating units of the formula: wherein R1 is a tetravalent organic group having 4 or more carbon atoms; R2 is a trivalent or tetravalent organic group having one or more aromatic rings; R3 is a monovalent organic group; A is a monovalent group showing acidity; and n is an integer of 1 or 2, is effective for preparing a highly sensitive negative-working photosensitive material developable with an alkaline aqueous solution in a short time with high resolution.
Claims7
A process for forming a resin pattern, which comprises:
- forming a film of a negative-working photo-sensitive polyimide precursor composition on a substrate;
- exposing the film to light through a mask having a predetermined pattern;
- and
- developing the exposed film using an alkaline aqueous solution;
- and
- wherein the polyimide precursor is contained in an amount of 100 parts by weight, together with 0.1 to 50 parts by weight of photosensitizer, and 0.1 to 50 parts by weight of a photopolymerization auxiliary agent;
- wherein the polyimide precursor composition comprises a polyimide precursor having repeating units of the formula:
- wherein R1 is a tetravalent organic group having 4 or more carbon atoms;
- R2 is a trivalent or tetravalent organic group containing one or more aromatic rings;
- R3 is a monovalent photosensitive organic group;
- A is a monovalent group showing acidity;
- and n is an integer of 1 or 2.
A process for forming a resin pattern, which comprises
- forming a film of a negative-working photosensitive polyimide precursor composition on a substrate,
- exposing the film to light through a mask having a predetermined pattern, and
- developing the exposed film using an alkaline aqueous solution;
- wherein the polyimide precursor is contained in an amount of 100 parts by weight, together with 0.1 to 50 parts by weight of photosensitizer, and 0.1 to 50 parts by weight of a photopolymerization auxiliary agent;
- wherein the polyimide precursor composition has repeating units of formula:
- wherein R1 is a tetravalent organic group having 4 or more carbon atoms;
- R2 is a trivalent or tetravalent organic group containing one or more aromatic rings;
- R3 is a monovalent photosensitive organic group;
- A is a monovalent group showing acidity;
- and n is an integer of 1 or 2;
- and
- wherein the polyimide precursor further has repeating units of the formula:
- wherein R1 is a tetravalent organic group having 4 or more carbon atoms;
- R2 is a trivalent or tetravalent organic group having one or more aromatic rings;
- R3 is a monovalent photosensitive organic group;
- R4 is a divalent organic group containing one or more aromatic rings or silicon atoms;
- the number of repeating units of the formula (21-1) being 10 or more, and the number of repeating units of the formula (21-2) being 90 or less, when a total of repeating units of the formulae (21-1) and (21-2) is 100.
Dependencies are inferred from the claim text.