Scanning exposure method utilizing alignment marks based on scanning direction
AssigneeNikon Corporation
InventorNobutaka Magome
Life of this patent
Estimating the term…
Abstract
A mask pattern is transferred onto a wafer by exposure with a mask stage and a wafer stage being moved synchronously. In global alignment of the mask and the wafer, the scanning direction in the present (second layer) scanning exposure is made coincident with the scanning direction in the preceding (first layer) scanning exposure. When alignment is made by calculating shot array coordinates in advance, shot array coordinates are calculated for each scanning direction.
Claims31
An exposure method comprising the steps of:
- selecting at least two marks from a plurality of marks formed on a substrate by a scanning exposure of a step-and-scan type;
- and
- calculating an exposure position with respect to a predetermined region on the substrate on the basis of the positional information on the selected at least two marks,
- wherein the at least two marks arc selected in consideration of a direction of scanning for scanning exposure carried out when said marks are formed on said substrate.
An exposure method comprising the steps of:
- measuring positional information on first marks formed on a substrate by carrying out scanning exposure in a first direction;
- measuring positional information on second marks formed on the substrate by carrying out scanning exposure in a second direction different from the first direction;
- calculating an average value of the positional information on the first mark and the positional information on the second mark;
- calculating an exposure position with respect to a predetermined region on the substrate on the basis of the calculated average values;
- and
- transferring a circuit pattern onto the substrate on the basis of the calculated exposure position.
An exposure method comprising the steps of:
- measuring positional information on a plurality of marks on a substrate, which are formed by a scanning exposure of a step-and scan type;
- and
- storing the positional information on the plurality of marks and a direction of scanning for forming the marks on the substrate in association with each other.
An exposure method comprising the step of calculating an exposure position with respect to a shot region on a substrate formed by scanning exposure in a first direction and an exposure with respect to a shot region on the substrate formed by scanning exposure in a second direction different from the first direction, based on either a plurality of first marks formed on the substrate or a plurality of second marks formed on the substrate.
A method for producing a circuit element, comprising the steps of:
- selecting at least two marks from a plurality of marks on a substrate, which are formed by a scanning exposure of a step-and-scan type:
- calculating an exposure position with respect to a predetermined region on the substrate on the basis of the positional information on the selected at least two marks;
- and
- transferring a pattern of the circuit element onto the substrate on the basis of the calculated exposure position,
- wherein the at least two marks are selected in consideration of a direction of scanning for scanning exposure carried out when said marks are formed on said substrate.
a method for producing a circuit element, comprising the steps of:
- calculating an exposure position with respect to a shot region on a substrate formed by scanning exposure in a first direction and an exposure position with respect to a shot region on the substrate formed by scanning exposure in a second direction different from the first direction, based on either a plurality of first marks formed on the substrate or a plurality of second marked formed on the substrate;
- and
- transferring a pattern of the circuit element onto the substrate on the basis of the calculated exposure positions.
An exposure method comprising the steps of:
- forming a plurality of marks on a substrate by exposure action, said exposure action including a scanning exposure in the first direction and a scanning exposure in the second direction which is different from the first direction;
- selecting at least two marks from the plurality of marks, which are formed by the scanning exposure in the same direction carried out when said marks are formed;
- and
- controlling a position of a stage on the basis of the positional information on the selected at least two marks, said stage moving with supporting said substrate.
Dependencies are inferred from the claim text.