Method for making a photomask with multiple absorption levels
AssigneeMicron Technology, Inc.
InventorAlan R. Reinberg
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AssigneeMicron Technology, Inc.
InventorAlan R. Reinberg
Estimating the term…
A photomask for manufacturing a semiconductor device. The photomask is manufactured by a providing a photomask substrate and alternately depositing a plurality of layers of a light-absorbing material and of an etch-stop material on the photomask substrate. The light-absorbing material is selected as having a well-defined etching selectivity from that of the etch-stop material. The layers are successively patterned by removing by a selective etching process at least a portion of at least one of said layers, the portion removed from a lower, in relation to the substrate, layer a subset of the portion removed from a higher layer. Together, the patterned layers are used as a photomask to photolithographically imprint a pattern of a photoresist on a semiconductor wafer under manufacture. The photoresist is used in the etching process of the semiconductor wafer.
A photomask, comprising:
A photomask, comprising:
A photomask, comprising:
A method for manufacturing a photomask having multiple light-absorbing levels, the method comprising the acts of:
A method for manufacturing a photomask having multiple light-absorbing levels, the method comprising the acts of:
A method of manufacturing a photomask, comprising the acts of:
A method of manufacturing a photomask having multiple light-absorbing levels, the method comprising the acts of:
A method of manufacturing a photomask, comprising the acts of:
Dependencies are inferred from the claim text.