Semiconductor sealing resin composition, semiconductor device sealed with the same, and process for preparing semiconductor device

Abstract

The present invention relates to a semiconductor encapsulating resin composition which is safe and superior in moisture resistance, flame retardance and moldability, and to a highly reliable semiconductor device which is fabricated by encapsulating a semiconductor element with such a semiconductor encapsulating resin composition. The resin composition according to the present invention comprises a thermosetting resin, a hardening agent and a compound metal hydroxide of polyhedral crystal form represented by the following general formula (1): m(MaOb).n(QdOe).cH2O  (1) [wherein M and Q are different metal elements; Q is a metal element which belongs to a group selected from IVa, Va, VIa, VIIa, VIII, Ib and IIb groups in the periodic table; m, n, a, b, c, d and e, which may be the same or different, each represents a positive number]. In accordance with the present invention, reduction in the fluidity of the resin composition can be suppressed, so that transfer molding can be performed with an improved moldability without any trouble. Further, the resin composition ensures improvement in soldering resistance and mechanical strength.

Dependencies are inferred from the claim text.