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US 6,319,461 B1Granted
Lead-free solder alloy
AssigneeNippon Sheet Glass Co., Ltd.
InventorsShinjiro Domi, Koichi Sakaguchi, Shigeki Nakagaki, Katsuaki Suganuma
Life of this patent
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Abstract
A lead-free solder alloy substantially contains Sn and Ti, and has a temperature of a liquidus line of not greater than 400° C. The lead-free solder alloy contains no toxic lead and has sufficient bonding strength to oxide materials such as glass and ceramics.
Claims17
A lead-free solder alloy containing Sn and Ti and having a liquidus temperature not greater than 400° C., and further containing at least 0.001% by weight O.
Dependencies are inferred from the claim text.