Process of molding an insert on a substrate

Abstract

A molded structure formed in a mold having a space, the molded structure itself constituting a molding body when combined with an upper mold. The molded structure has a substrate which may be a carrier frame for an electrical connector. An insert which may be an elastomer is disposed on the substrate and formed in the space in the mold. A deformable (preferably elastic) molding seal is disposed directly on the substrate and under the elastomer, the molding seal preventing elastomer flash during molding. The molding seal may be a ridge surrounding the space of the mold in which the elastomer is formed. The substrate may also have a datum surface on which the mold locates, with the molding seal disposed in a plane which differs from the plane of the datum surface of the substrate. A process of molding the insert on the substrate is also provided.

Dependencies are inferred from the claim text.