US 6,319,447 B1 · Resin transfer molding process

Abstract

The present invention relates to a seal pin indexed precisely in a resin transfer molding die to assure the desired resin-to-fiber ratio in the mold part, and, thereby, to produce reliably and consistently a part of minimum weight with adequate strength. The index/resin seal pin of the present invention for RTM mold dies is novel in that it provides the seal (via replaceable O-rings) on the threaded stem of the pin to prevent low viscosity resin from invading the threads, bolts pins, or other elements of the internal mandrel. The pin allows the entire inner mandrel to be enclosed and sealed within the mold cavity, simplifying the sealing system. The invention also relates to a method for using the seal pin in a resin transfer molding process.

Claims1

Dependent claims

A method for assuring adequate strength throughout a molded part made by resin transfer molding, comprising the steps of:

(a) applying a fiber preform around a mandrel;
(b) positioning the mandrel precisely in a mold using sealing index pins that assure close tolerances between the fiber preform and the outer mold line of the part as defined by the mold, the sealing index pins including a self-centering bulge adapted for seating in a positioning and indexing groove in the mold;
(c) injecting resin into the mold so that the sealing index pins prevent resin from bleeding out of the area surrounding the preform and maintain the close tolerances to assure a molded part of desired fiber-resin ratio throughout and adequate strength.

Dependencies are inferred from the claim text.

Resin transfer molding process

Life of this patent

Resin transfer molding process

Life of this patent

Abstract

Claims1