Device and method for evening out the thickness of metal layers on electrical contact points on items that are to be treated

Method for evening out the thickness of metal layers on electrical contact points on flat items to be treated, during electrolytic treatment of items guided in a horizontal plane of conveyance in a continuous electroplating plant, which device has

• a) counter-electrodes located opposite the plane of conveyance,
• b) clamps for contacting the items to be treated, secured to a continuously revolving means of conveyance and having respectively a lower portion and an upper portion,
• i. being electrically conductive,
• ii. having a surface comprised of metal,
• iii. being movable in relation to one another and
• iv. having respectively at least one contact point for the items to be treated, and
• c) at least one current source to produce a flow of current between the counterelectrodes and the clamps,
• characterized in that, between the counter-electrodes (2,3) and the clamps (4) are disposed upper and lower shields (15, 16) for the electrical field, the shields being arranged with respect to the upper and lower clamp portion, respectively, in such a manner that electroplating of these clamp portions is avoided, the shields further extending so close to the plane of conveyance that the items to be treated, guided in the plane of conveyance, and the clamp portions (13, 14) do not quite come into contact with the shields.

Device for evening out the thickness of metal layers on electrical contact points on flat items to be treated, during electrolytic treatment of the items to be treated, led in a horizontal plane of conveyance in a continuous electroplating plant, which device has

• a) counter-electrodes located opposite the plane of conveyance,
• b) clamps secured to a continuously circulating means of conveyance, for contacting the items to be treated, the clamps having repsectively a lower portion and an upper portion,
• i. which are electrically conductive,
• ii. have a surface comprised of metal,
• iii. may be moved in relation one another and
• iv. respectively have at least one contact point for the items to be treated, and
• c) at least one current source to produce a flow of current between the counterelectrodes and the clamps,
• characterized in that, between the counter-electrodes (2,3) and the clamps (4) are disposed screens (22) for the electrical field, which do not contact the lower portion of the clamps, and which extend so close to the plane of conveyance that the items to be treated, guided in the plane of conveyance do not quite come into contact with the screens.

Method for evening out the thickness of metal layers on electrical contact points on flat items to be treated, during electrolytic treatment of items guided in a horizontal plane of conveyance in a continuous electroplating plant, which device has

• a) counter-electrodes located opposite the plane of conveyance,
• b) clamps for contacting the items to be treated, secured to a continuously revolving means of conveyance and having respectively a lower portion and an upper portion,
• i. being electrically conductive,
• ii. having a surface comprised of metal,
• iii. being movable in relation to one another and
• iv. having respectively at least one contact point for the items to be treated, and
• c) at least one current source to produce a flow of current between the counterelectrodes and the clamps,
• characterized in that, between the counter-electrodes (2,3) and the clamps (4) are disposed screens (22) for the electrical field, which do not contact the lower portion of the clamps, and which extend so close to the plane of conveyance that the items to be treated, guided in the plane of conveyance do not quite come into contact with the screens.