Imaging element assembly unit for endoscope

Abstract

The present invention is an imaging element assembly unit in which it can easily be promoted to make the diameter of the tip portion of an endoscope thinner by changing the configuration of a circuit board in relation to an image element. In this assembly unit, an imaging element body formed while holding a lead portion between an electrode of a CCD and a cover glass is produced, for example, on the TAB system, and this imaging element body is connected to a circuit board having a storing groove. Then, the width in the electrode arranging direction of this circuit board is formed shorter than the width in the electrode arranging direction of the CCD, and at a position where both ends of this circuit board retreat from both ends of the CCD, these are connected by a lead portion. By doing so, the diameter of the tip portion can be made thinner since the sides of both ends of the circuit board arranged on the side of the inside peripheral surface of a tip portion holding barrel retreat inside.

Dependencies are inferred from the claim text.