Chemical mechanical polishing apparatus

A chemical mechanical polishing apparatus, comprising:

• a rotatable wafer holder;
• having an axis of rotation a wafer fixed on said wafer holder, said wafer including a surface to be polished;
• means for feeding said rotatable wafer holder along said axis
• a slurry supplier for supplying slurry to said surface of said wafer;
• a pair of driving rollers horizontally arranged beneath the wafer holder, said driving rollers rotating in a reciprocal movement;
• a polishing wire wound on the driving rollers and moving in a linear reciprocal movement as the driving rollers are rotated in their respective reciprocal movement thereby contacting and rubbing on the surface to be polished of said wafer fixed on said wafer holder;
• a pair of guide-rollers horizontally arranged outside of the respective driving rollers wherein opposite ends of said polishing wire are wound thereon to thereby apply tension to said polishing wire;
• a pair of driven rollers arranged beneath the driving rollers, said polishing wire being wound thereon and thereby guided to the driving rollers;
• wherein the surface of the wafer is polished by the slurry and the linear reciprocal movement of the polishing wire.