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US 6,319,095 B1Granted
Colloidal suspension of abrasive particles containing magnesium as CMP slurry
AssigneeAgere Systems Guardian Corp.
InventorsSailesh Mansinh Merchant, Sudhanshu Misra, Pradip Kumar Roy
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Abstract
An improved colloidal slurry for chemical mechanical polishing and methods of polishing using the improved colloidal slurry.
Claims15
A method for polishing a surface of an integrated circuit comprising:
- a. applying a colloidal slurry, having abrasive particles containing a magnesium compound, to said surface;
- b. polishing said surface with a polishing implement;
- and
- c. rinsing said surface with a solution that reacts with said magnesium compound to form a water soluble salt to remove said colloidal slurry and particles generated from said polishing.
1 more element
Dependencies are inferred from the claim text.