Method and apparatus for forming modular sockets using flexible interconnects and resulting structures
AssigneeMicron Technology, Inc.
InventorsWarren M. Farnworth, David J. Corisis, Salman Akram
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Abstract
A modular bare die socket assembly for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in a horizontal stack, wherein each plate has a die socket for the removable insertion of a bare semiconductor die. A multi-layer interconnect lead tape has a plurality of lithographically formed leads bent on one end to form nodes for attachment to bond pads on the removably inserted semiconductor die, and having opposing ends connectable to the substrate.
Claims44
An insertion module for a bare semiconductor die, said semiconductor die having a plurality of bond pads on a surface thereof, said insertion module comprising:
- a plurality of plates, each plate of said plurality of plates having a first major side and a second major side, each major side of said first major side and said second major side having a first end and second end, the first major side of a first plate of said plurality of plates abutted to the second major side of a second plate of said plurality of plates forming a bare die socket having a die slot at a first end and a lead slot at a second end, the first end and the second end of the bare die socket each formed by the first ends of two abutted said first plate and said second plate and the second ends of two abutted said first plate and said second plate;
- a multi-layer interconnect lead tape including a pattern of electrically conductive leads formed on an insulative film, a plurality of conductive leads of said pattern of said electrically conductive leads having inner ends for resilient electrical contact with at least one bond pad of said plurality of bond pads of said semiconductor die and outer ends for at least one lead of said plurality of conductive leads to electrically contact a substrate;
- and
- resilient apparatus for forcing said inner ends of said plurality of conductive leads of said pattern of electrically conductive leads into resilient contact with said at least one bond pad of said plurality of bond pads of said semiconductor die.
An module for contact with a portion of a semiconductor die, said semiconductor die having a plurality of bond pads on a surface thereof, said module comprising:
- a plurality of plates, each plate of said plurality of plates having first major side and second major side and a first end and a second end, the first major side of a first plate of said plurality of plates abutting the second major side of a second plate of said plurality of plates to form a bare die socket having a die slot located at said first end of said first plate and said first end of said second plate and a lead slot located at said second end of said first plate and said second plate;
- a multi-layer interconnect lead tape comprising a pattern of leads located on insulative film, at least one lead of said pattern of leads having an inner end for contact with at least one bond pad of said plurality of bond pads of said semiconductor die and at least one outer end for contacting a substrate;
- and
- resilient apparatus for biasing at least one inner end of at least one lead of said pattern of leads into resilient contact with said plurality of bond pads of said semiconductor die.
A bare semiconductor die interconnect socket for electrical connection to traces of a substrate, said socket comprising:
- a plurality of multi-layer interconnect lead tapes, each multi-layer interconnect lead tape having a plurality of leads;
- a plurality of plates, each plate of said plurality of plates stacked in side by side relation to another plate, two adjacent plates stacked in a side by side relation of said plurality of plates having a bare die insertion slot and a lead tape insertion slot;
- one multi-layer interconnect lead tape of said plurality of multi-layer interconnect lead tapes placed through each said lead tape insertion slot between said two adjacent plates in said side by side relation of said plurality of plates.
A plate for abutting another adjacent plate for forming an interconnect socket for connecting a bare semiconductor die to a substrate, said plate comprising:
- at least two generally planar members formed of an insulative material, each of said at least two generally planar members having a first side, a second side, a first end and a second end;
- said second side including a recessed die slot therein for insertion of a bare semiconductor die from said first end of said each of said at least two generally planar members;
- and
- said first side including a recess for holding a portion of an interconnect lead tape for resiliently contacting a portion of said bare semiconductor die and a portion of said substrate
- whereby said second side of a first generally planar member abutted to a first side of another adjacent generally planar member forms an interconnect socket for removable insertion of said bare semiconductor die for electrical interconnection to said substrate.
A multi-layer interconnect tape for interconnecting bond pads of a semiconductor die to a substrate, said tape comprising:
- a first layer of insulative film having first and second surfaces;
- a second layer of conductive material formed on said first surface of said first layer of insulative film, said second layer of conductive material including a plurality of leads, each lead of said plurality of leads having a first end bent for contact with at least one bond pad of said bond pads of said semiconductor die and having a second end for connection to said substrate.
Dependencies are inferred from the claim text.